6061/T2 aluminum copper clad plate

6061/T2 Aluminum Copper Clad Plate - High-Performance Bimetallic Solution

The 6061/T2 aluminum copper clad plate from Baoji City ShenAo Metal Materials delivers exactly that. This advanced bimetallic composite metallurgically bonds T2 electrolytic copper with 6061 aluminum alloy, achieving interface shear strength exceeding 65 MPa and bonding rates above 99%. You get exceptional electrical conductivity (>58 MS/m) from the copper layer while enjoying 40-60% weight reduction compared to solid copper. With our 17 years of explosive welding expertise and rigorous ultrasonic testing protocols, we ensure every plate meets enterprise-grade reliability standards for demanding applications.

What Makes This Composite Material Different?

You're likely recognizable with the challenge: copper conducts perfectly but weighs as well much and costs as well much. Aluminum is lightweight and reasonable but doesn't conduct as well.

The item fathoms this "conductivity vs. weight" problem elegantly.

We utilize progressed solid-state holding techniques—explosive cladding or persistent rolling—to make a molecular-level move between layers. This dispenses with the electrical resistance and mechanical disappointment dangers you'd experience with shot joints or straightforward brazing.

The result? A consistent composite that performs like copper where you require it whereas keeping in general weight and taken a toll down.

Technical Specifications at a Glance

Key Performance Advantages

Predominant Conductivity Where It Counts

The T2 copper layer conveys 100% IACS conductivity. Your electrical associations stay effective and reliable.

Structural Quality You Can Trust

The 6061 aluminum base gives pliable quality ≥260 MPa in T6 mood. You get basic astuteness for requesting mechanical applications.

Lightweight Plan Benefits

Experience 40-60% weight reserve funds versus strong copper. This makes a genuine contrast in transportation applications and establishment efficiency.

Thermal Administration Excellence

The coordinates interface guarantees predominant warm dissemination. Warm spreads quickly from hotspots through the copper layer whereas the aluminum base effectively disseminates it.

Exceptional Bond Integrity

Interface shear quality surpasses 65 MPa. The metallurgical bond won't delaminate amid machining, bowing, or warm cycling.

Where You'll Use This Material?

New Energy Vehicles

Battery pack busbars require safe connections between copper terminals and aluminum housings. This 6061/T2 aluminum copper clad plate composite prevents electrochemical corrosion while handling high currents efficiently.

Power Transmission Systems

High-voltage switchgear and transformers benefit from the copper face's low-resistance contact surface. Meanwhile, the aluminum body reduces total busbar weight and cost dramatically.

Power Electronics Cooling

High-density IGBT heatsinks demand rapid heat spreading and structural rigidity. The T2 layer handles localized hotspots while the 6061 base provides vibration resistance in aerospace environments.

Product production process

Why Partner with ShenAo Metal Materials?

Since 2008, we've specialized in non-ferrous metal composite materials from China's Titanium Valley. Our experienced R&D team works closely with your requirements to develop optimal solutions.

You benefit from:

· 17 years of stable production expertise

· Strict process technology and quality standards

· Customized specifications for your unique applications

· Fast delivery efficiency to global customers

· Comprehensive after-sales support

We've established partnerships with hundreds of equipment manufacturers and electrochemical enterprises who trust us as their long-term supplier.

Our Quality Assurance Process

We do not fair manufacture—we confirm each basic parameter:

100% Ultrasonic Testing

C-scan imaging guarantees holding rates surpass 99% over the whole interface.

Rigorous Mechanical Testing

Shear and peel quality tests confirm metallurgical bond astuteness some time recently shipping.

Electrical Conductivity Mapping

Eddy current testing affirms the T2 layer meets IACS conductivity standards.

Formability Verification

90-degree and 180-degree twist tests guarantee no delamination or micro-cracking occurs.

Environmental Push Testing

Salt shower testing and warm stun cycling assess long-term erosion resistance and interface steadiness.

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Our Packaging

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Frequently Asked Questions

Does the composite interface increase electrical resistance?

No. The metallurgical bond creates a molecular-level transition with lower resistance than mechanical bolting or soldering.

Can I laser cut and CNC machine this material?

Yes, it machines excellently. Just adjust tool parameters to account for varying hardness between the T2 and 6061 layers.

What's the maximum operating temperature?

The bond remains stable up to 300°C. Beyond this temperature, diffusion rates increase, which may affect ductility over time.

How do I protect exposed edges from corrosion?

In extreme environments, we recommend edge sealing with epoxy or nickel/tin plating the entire component.

Can you provide custom thickness ratios?

Absolutely. While 1:1, 1:2, and 1:3 (Cu:Al) ratios are standard, we produce custom ratios via rolling or cladding to meet your specific current-carrying requirements.

Contact Us

Ready to discuss your 6061/T2 aluminum copper clad plate requirements? Reach out to our team at zh@baojiti.com.cn for technical specifications and custom solutions.